Advanced Packaging Market 2023- by End Use (Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Others) and Type (Flip Chip CSP, Flip-Chip Ball Grid Array, Wafer Level CSP, 2.5D/3D, Fan-Out WLP, and Others) - Partner & Customer Ecosystem (Product Services, Proposition & Key Features) Competitive Index & Regional Footprints by MarketDigits - Forecast 2024-2032

Industry : Packaging | Pages : 180 Pages | Upcoming : Jun 2024


In 2022, the Global Advanced Packaging Market reached a value of $29.42 billion and is projected to reach $64.19 billion by 2030, with a compound annual growth rate (CAGR) of 10.2% from 2023 to 2030.

Advanced packaging plays a crucial role in safeguarding silicon wafers, logic units, and memory from physical damage and corrosion during the final stages of semiconductor manufacturing. It enables the connection of chips to circuit boards. Various techniques are employed in advanced packaging, including 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package.

With the rapid growth of the advanced packaging market, particularly in fan-out wafer level packaging, coupled with the increasing demand for smartphones, devices, and the Internet of Things (IoT), suppliers are focusing on developing processes and methods to reduce overall costs and enhance operational efficiency in advanced packaging. While advanced packaging is currently prevalent in high-end products and niche-market applications such as wafer and die production due to its higher operational costs, different integrated circuits (ICs) have varying packaging requirements, presenting growth opportunities for advanced packaging over traditional packaging processes. Furthermore, advanced packaging is expected to offer superior capabilities compared to conventional packaging solutions, creating lucrative opportunities for the market in the coming years.

The Global Advanced Packaging Market is analyzed based on type, end use, and region. The types of advanced packaging include flip chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan-out WLP, and others. The market is segmented by end use into consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. Regionally, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA, including their prominent countries.

Top Impacting Factors
The global advanced packaging market growth is influenced by several significant factors. One of these factors is the increasing demand for device miniaturization, as well as improved system performance and optimization offered by advanced packaging solutions. However, the high cost associated with advanced packaging has been a hindrance to its widespread adoption, which has affected the market's growth. Conversely, the emerging trend of fan-out wafer level packaging presents promising opportunities for the advanced packaging market in the forecast period.

One of the major factors impacting the growth of the advanced packaging market is the growing demand for device miniaturization. Advancements in technology have led manufacturers to focus on providing compact electronic devices across various industry verticals such as consumer electronics, healthcare, automotive, and semiconductor IC manufacturing. These manufacturers are striving to reduce the size of integrated circuits to enable fine patterning on wafers and chips. Additionally, the medical devices industry is witnessing an increased demand for nano-sized robotic surgery equipment, as well as advancements in wearable and personalized healthcare gadgets. Consequently, the trend towards compact electronic devices has created a need for designers to move beyond traditional packaging solutions and adopt advanced packaging methods.

Improved system performances and optimization of advanced packaging
The semiconductor packaging industry plays a vital role in the development of next-generation chip designs by providing advanced IC packages. Traditionally, the integrated circuit industry relied on conventional chip scaling and innovative architectures for new devices. Furthermore, the prevalence of multi-chip packages in phones, data centers, consumer electronics, and networks has fueled the growth of advanced packaging, as it enables system optimization. Advanced packaging also facilitates the utilization of AI, machine learning, and deep learning by allowing different processing elements and memories to be integrated using high-speed interconnects. As a result, various industry verticals, including automotive, healthcare, aerospace & defense, and the industrial sector, are increasingly adopting advanced packaging to benefit from enhanced operational capabilities and precise processing.

However, the adoption of advanced packaging is hindered by its high cost. Compared to conventional packaging solutions used in the semiconductor industry, advanced packaging is a significantly more expensive process. The cost of designing and manufacturing chips at each new node is substantial, and the complexities involved in IC wafer fabrication contribute to higher costs. Additionally, the packaging of different chips and ICs with intricate patterning further increases the overall cost of advanced packaging, impeding its wider adoption.

Market Segmentation:
By Type
• Flip Chip CSP
• Flip-Chip Ball Grid Array
• Wafer Level CSP
• 5D/3D
• Fan Out WLP
• Others

By End Use
• Consumer Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & Defense
• Others

Competition Analysis
Prominent players with significant market share in the advanced packaging industry include Amkor Technology, Intel Corporation, Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, and Analog Devices, among others. These key market players are profiled in detail within this report and employ various strategies such as product launches, product development, collaborations, partnerships, and agreements to drive market growth.

Key Benefits for Stakeholders:
• This study provides an analytical overview of the global advanced packaging market, including its size, current trends, and future estimations, highlighting potential investment opportunities.
• The analysis aims to identify profitable trends in the advanced packaging market, assisting stakeholders in establishing a stronger market presence.
• The report offers insights into the key drivers, restraints, and opportunities in the advanced packaging industry, accompanied by a detailed impact analysis.
• Quantitative analysis of the current advanced packaging market forecast from 2022 to 2030 enables financial benchmarking and assessment of market competency.
• Porter's five forces analysis evaluates the bargaining power of buyers and suppliers within the advanced packaging market.



Table and Figures


At MarketDigits, we take immense pride in our 360° Research Methodology, which serves as the cornerstone of our research process. It represents a rigorous and comprehensive approach that goes beyond traditional methods to provide a holistic understanding of industry dynamics.

This methodology is built upon the integration of all seven research methodologies developed by MarketDigits, a renowned global research and consulting firm. By leveraging the collective strength of these methodologies, we are able to deliver a 360° view of the challenges, trends, and issues impacting your industry.

The first step of our 360° Research Methodology™ involves conducting extensive primary research, which involves gathering first-hand information through interviews, surveys, and interactions with industry experts, key stakeholders, and market participants. This approach enables us to gather valuable insights and perspectives directly from the source.

Secondary research is another crucial component of our methodology. It involves a deep dive into various data sources, including industry reports, market databases, scholarly articles, and regulatory documents. This helps us gather a wide range of information, validate findings, and provide a comprehensive understanding of the industry landscape.

Furthermore, our methodology incorporates technology-based research techniques, such as data mining, text analytics, and predictive modelling, to uncover hidden patterns, correlations, and trends within the data. This data-driven approach enhances the accuracy and reliability of our analysis, enabling us to make informed and actionable recommendations.

In addition, our analysts bring their industry expertise and domain knowledge to bear on the research process. Their deep understanding of market dynamics, emerging trends, and future prospects allows for insightful interpretation of the data and identification of strategic opportunities.

To ensure the highest level of quality and reliability, our research process undergoes rigorous validation and verification. This includes cross-referencing and triangulation of data from multiple sources, as well as peer reviews and expert consultations.

The result of our 360° Research Methodology is a comprehensive and robust research report that empowers you to make well-informed business decisions. It provides a panoramic view of the industry landscape, helping you navigate challenges, seize opportunities, and stay ahead of the competition.

In summary, our 360° Research Methodology is designed to provide you with a deep understanding of your industry by integrating various research techniques, industry expertise, and data-driven analysis. It ensures that every business decision you make is based on a well-triangulated and comprehensive research experience.

Customize your Report
• Tailored advice to Drive your Performance
• Product Planning Strategy
• New Product Stratergy
• Expanded Research Scope
• Comprehensive Research
• Strategic Consulting
• Provocative and pragmatic
• Accelerate Revenue & Growth
• Evaluate the competitive landscape
• Optimize your partner network
• Analyzing industries
• Mapping trends
• Strategizing growth
• Implementing plans
A comprehensive cogent custom study with Analyzing Industries, Mapping Trends, Straterging growth & Implementing Plans. An in-depth and breadth of composite research, which gives complete support of the generation and evaluation of growth opportunities, and best practices recognition to help increase the revenue. Request a Custom Research below.
Request Customization

Covered Key Topics

Growth Opportunities

Market Growth Drivers

Leading Market Players

Company Market Share

Market Size and Growth Rate

Market Trend and Technological

Research Assistance

We will be happy to help you find what you need. Please call us or write to us:

+1 510-730-3200 (USA Number)